Astride the Packaging Roadmap

The National Microelectronics Institute (NMI) and TWI are organising the fourth in a series of annual one-day seminars addressing microelectronics packaging trends, technologies and applications which is being hosted at TWI, Granta Park, Great Abington, Cambridge. The 2009 seminar focuses on the Microelectronics Packaging Roadmap and has been timed to coincide with the recent publication of the 2009 Global Packaging Roadmap by the International Electronics Manufacturing Initiative (iNEMI) who are headquartered in the USA. 

The seminar will include a keynote address from iNEMI to introduce their 2009 Packaging Roadmap and technical presentations addressing both packaging applications and technologies of interest to the UK microelectronics design and manufacturing community in the area of wireless communications, power and automotive electronics.

This Packaging Roadmap seminar provides a unique opportunity for system designers, device designers, packaging and interconnection engineers, technology developers, device and systems applications engineers in the electronics, photonics and sensors industries to gain an overview of UK and global packaging technology requirements, capabilities and trends and to network with colleagues, design and technology providers in this key technology area.

 

Note : presentations and the attendee list from this event are available in the members' area

The provisional seminar programme is as follows:

08.30   Coffee and Registration

09.10   Welcome and Introduction; Paul Jarvie, NMI AND David Pedder, TWI

09.30   Keynote - The iNEMI Roadmap 2009, Grace O’Malley, iNEMI 

10.30   Refreshment break, networking, tabletops

11.00   A package fit for purpose, tba, CSR

11.30   Packaging Technologies for Power Electronics, David Newcombe, Dynex Semiconductor

12.00   Lunch, networking, tabletops

13.30   tba, Thorsten Bucksch, RoodMicrotec

14.00   Package technology development for SiP, Alan Evans, Unisem

14.30   System-in-Package and Passive Integration - options and directions, David Pedder, TWI

15.00   Refreshment break

15.30   Influence of Package Choice on your System Reliability, Nick Renaud-Bezot,

Serma Technologies 

16.00   Close 

 

Event Sponsors/Supporters

The seminar is kindly sponsored by Unisem and is supported by the Photonics KTN and by IMAPS UK.