This NMI-TWI Partner event on "Packaging and Interconnection for Electronics and Sensors" will provide a review of "Past, Present and Future" technology.

Agenda: ( Download Detail Agenda ) [444kB]

The Event will include an outstanding list of speakers from companies such as  Irisys, CSR, IMEC, Tyndall, Zarlink, TWI and will provide a blend of Technical presentations , Table tops and demonstrations from Industry.

Delegates will have an excllent opportunity to update their technical knowledge, network with the experts and view practical demonstrations and Lab facilities at TWI.

Registration:

Please click to REGISTER