IMAPS-UK One Day Technical Seminar:

UK Microelectronics Packaging Society (IMAPS-UK) is holding a one day technical seminar and industry networking event in conjunction with the Innovative electronics Manufacturing Research Centres (IeMRC), The Welding Institute (TWI) and The National Physical Laboratory (NPL) at the NPL, Teddington TW11 0LW, on the 30th June 2010.

The event will provide the opportunity for:

•    Technology updates on new exciting interconnection processes & materials
•    Networking between end-users, supply chains and technology providers
•    Business development opportunities for your Company & its products

Introduction:

As engineers are presented with the challenge of fitting more functionality into smaller spaces, getting more power out of devices, dissipating increasing levels of heat from components and ensuing improved levels of reliability, the methods used for interconnect are often key in achieving these goals.

The IMAPS-UK “Beyond Solder” Technical Seminar will investigate the different interconnection methods being used and developed today, which overcome these challenges, these include:

•    Ultrasonically bonded interconnects
•    Reliable connections for harsh environments
•    Conductive adhesives for chip bonding
•    Press-fit connections for high reliability applications
•    Welding of ultra thin wires & ribbons
•    Nano-scale interconnects
•    Innovative die & component attach materials
•    Industrial “Solder Free” connections

Who Should Attend:

Research & Development Engineers, Scientists, Production & Manufacturing Engineers, Supply Chain Companies, Process Engineers, Product Designers & Students

Summary of Technical Programme:

The Seminar will comprise seven technical presentations in four sessions, with coffee & lunch breaks in between. These will be followed by a general discussion, which will review and asses the challenges in packaging that need to be addressed for different applications. There is also ample opportunity for networking with fellow delegates from leading companies and institutions in the UK.

Keynote Paper: IeMRC: Martin Goosey

Adhesive Innovations For Component & Die Attach, Henkel: Tony Winster

Advanced Wire Bonded Interconnects, Kulicke & Soffa: Simon Broadhurst

Press Fit Connections For Automotive & High Reliability Applications, Panda Europe: Andy Longford

End of Life Options For Electronic Interconnects, NPL: Martin Wickham

Joining & Packaging Technologies For High Temperature Electronics, TWI: Norman Stocham

Bonding With Nanotechnology, Indium Corporation (Europe): Mike Fenner

Optimisation Of A Process For A Fine Pitch ICA Interconnection, Irisys: Dr Alan Butler

Table Top Exhibition:
In addition, there is a complementary tabletop exhibition showcasing leading companies in the field.