Events
IC Package Innovation: Choosing the right solution
- Venue:
TWI, Cambridge
- Date:
- Thu 26 May 2011
- Time:
- 930 - 1600
- Cost:
FREE to NMI members and invited guests
- Booking Details:
Delegate Registration:
SOLD OUT. Please email us if you wish to be put on the waiting list (in case of any cancellations).
Table Top Exhibitor:
To reserve an Exhibitor space please contact paul.jarvie@nmi.org.uk or call +44 (0) 7739427766
Venue:
Accommodation:
Join us at the extensive facilities of TWI in Cambridge to learn about the latest Package Innovation technology challenges and solutions including a Key Note from iNEMI on "Technology trends & Roadmaps for Package Innovation"
Overview:
Applications and Markets are drving the need for ever increasing Package Technology innovations. There has never been so much choice in Package Technology options however companies require to choose the righ solution with an understanding of how to make it work for them based on several key criteria such as:
- Understanding the Package Technology options
- Cost drivers / options
- Thermal considerations / Reliability
This IC Pacakge Network event looks at the Emerging technologies including what you need to know in making the right choices in topics such as such as Copper Bonding technology/ 3D Technology/Thermal Modelling.
Outline Agenda (Download full agenda)
Key Note:
iNEMI, Grace O'Malley, Consultant - European Operations
Technology trends & Roadmaps for Packaging Innovation
ST-Ericsson, Yann Guillou - 3D & Advanced Packaging, Back-End Technology Sourcing
Packaging Technologies for Smartphones and Tablets: Trends, Challenges, Roadmaps.
TWI, Andrew Whitaker - Technology Manager for Microtechnolgy and Consultant Engineer / Norman Stockham - Electronics, Photonics, Sensors and Nanotechnology Sector Manager
IC Packaging for Harsh Environments and Testing
Global Unichip Corp, Larry Zu - Senior Director of Sales and Engineering
The driving force behind today's packaging technology, SiP, 3D, Cu pillar, and Cu wirebond
ASE, Brad Factor, Director, Packaging Technology
Industrialization of copper wirebonding
Picochip, Mark Dellow, Senior Product Engineer
Transition To Copper Bonding - An End User Perspective
Bourns, Adrian Dent, Quality & Subcon Assembly Manager
Copper bonding in Opto Package applications
Eltek semiconductors, Mark Nichols, Sales Manager
Hi Reliability packaging
Panel Session: Chaired by Dr David Pedder, David Pedder Associates
Note:
All Delegates will receive a briefing document which provides an overview of latest release of the iNEMI 2011 Packaging Roadmap Survey.
Sponsors:
Host: Supported by:
Exhibitors:
Ansys, Eltek Semiconductors, Global Unichip Corp., IeMRC, imaps, Inseto, Mfg Vision, Optocap, Unisem