Note: Parking for this event will be at 300 Aztec West

Product companies are confronted with ever increasing engineering challenges in the design and manufacturing process of highly integrated microelectronic products. Awareness of the Application context (such as Mobile Consumer, Medical, Automotive or Aerospace) places distinct demands for product performance and reliability which must be carefully understood and managed to be competitive.

This event will explore the critical challenges of reaching market demanding product performance through design-for-manufacture in today's increasingly complex integrated circuits and systems.

 

Note : presentations and the attendee list from this event are available in the members' area

Agenda ( Detail Agenda available )

08:45 Registration, refreshments & table-tops

09:30 Session: Wireless Applications

Telefonica O2 UK, Keynote: Neil Warren, "Mobile Technologies & Customer Usability"

ST Microelectronics/ ST-Ericsson: Andy Lunness, Jonathan Edwards "Everything including the Chip" DfM Challenges and Advanced Packaging Technologies

Panel Session: The Philosophy of DfM - Significantly more than tools!

Guests: Cadence , O2 , ST Ericsson

 

Buffet Lunch / Networking / Table tops

13:30 Session: ...And More Matters of Application

C-MAC:  Paul Hill, "What DfM means to Hi-Reliability Applications"

Mentor Graphics: Barry Byford, "More Moore - Managing Variation"

Synopsys: Marco Casale-Rossi, tbc

Panel Session:  It's DfM, but not as we know it !

Guests: Synopsys, C-MAC, NXP Semiconductors

16:00 Close - Refreshments & Continued Networking

A table top exhibition will run alongside the sessions

Sponsorship and Table-Top Opportunities Available

Please contact Paul Jarvie for more details

This NMI Innovation Network Event is kindly sponsored by