Directions

(The event is being held at the Conference Centre at TWI. Please use the red route marked on the map and report to the security gatehouse upon arrival, you will then be directed to the car parking).

Accommodation

 

 

3D Packaging has become a key enabling technology in mainstream products such as Core Processors, FPGA's, Communications devices. This Network event provides an opportunity to learn about the latest developments in this exciting technology from Chip through Package to end application. Case study examples from Industry experts will share in depth knowledge on the benefits such as low cost / higher performance and challenges such as Test access and materials limitations. The event will include an exhibition of leading companies engaged in the supply chain of IC Package technologies.

If you are interested in Exhibiting or Sponsoring this event please contact Paul Jarvie at NMI

email Paul Jarvie or Mobile: +44(0) 7739427766

 

Event Host Event Supported by

               

 

Agenda:

09:00 ~ 09:45 Registration - Refreshments, Networking and Tabletop Exhibitions

         NMI, Paul Jarvie

         Welcome and Introduction 

Lancaster University, Prof. Andrew Richardson    

         Inside 3D Packaging technology

         Cambridge Integrated Knowledge Centre, Chris Rider

         Connecting Large Area Electronics

         Mentor Graphics, Per Viklund

         Advancements in 3D packaging - pushing the limit of EDA

         Plessey Semiconductors, Keith Strickland

         Packaging - An EPIC Story

12:30 ~ 13:30 Buffet Lunch, Exhibits & Networking

NMI, Dr Alastair McGibbon

NMI R&D Policy Support  

         ST Microelectronics, Ollie Althorpe       

         Interconnect Technology for 3D integration           

         IeMRC, Martin Goosey      

         Technology developments in 3D                

Q&A Session 

16:00 Event close