Building on the activities
of previous meetings, this year’s event has been extended
to 2 days and includes
a free evening dinner to assist networking. Day
1: Failure Analysis and the challenges of technology diversity
and evolution
09:00 Registration & Refreshments
Focusing on the requirements and techniques necessary to support
the growing number of technology options and seeks to create
awareness of technique and available options.
Speakers from : Wolfson Microelectronics, Solido, Maser Engineering,
NXP Semiconductors, FEI, Mentor Graphics, QinetiQ
Panel session : Wolfson Microelectronics, CSR, LSA, NXP Semiconductors,
Delta.
17:00 Day 1 Close
Day 2:
Quality Options: Dealing with advanced nodes, products and
applications
08:30 Registration & Coffee’s
This day explores quality strategy with specific focus on
test, characterisation and failure analysis.
Speakers from : UNISEM, CSR, Reltech, Si Venture, Mentor Graphics
* A half-day tutorial on design-for-test (DfT) is presented
by Professor Andrew Richardson of Lancaster University.
17:00 CLOSE
To complement the proceedings table-top demonstrations will
be available from leading service providers
CEMMNT, Si Venture, Maser Engineering, FEI , UNISEM, ExceptionPCB,
Sipeda, LSA
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