Network Manager:

Paul C Jarvie 

DDI: +44 (0)7739 427766

Network Events: 

Next Event:

2011 Q2, Theme & Venue (tbc)

Previous Events:

2010 May 25th, Lifting the hood on product design, TWI , Granta Park, Cambridge

2009 April 22, Astride the Packaging Roadmap, Cambridge

Click to download Exec Summary of the iNEMI Package Roadmap presented by Grace O'Malley

Click to request details on Full Summary ( FREE ) and Full Roadmap Report ( NMI member discount )

2008 June, Design for SiP, Cambridge

2007 June, System in Package, Cambridge 

2006 June, Wafer Level Packaging, Cambridge

Projects

FAMOBS ( Frequency Agile Microwave Bonding System )

NMI is a partner in the FAMONS Project which is funded under the European Framework 7 Programme. FAMOBS is a three year project with a total of 14 Partners. Focus of the project is the commercialisation of a novel microwave bonding system.

Overview of the Technology:

Curing can be realised using an open-ended microwave oven
The open oven has the potential to provide fast alignment of IC's
Flip-chip assembly, direct chip attach (DCA)
Surface mount assembly (SMA)
Wafer-scale level packaging (WSLP)

Expected Benefits:

• Reduced package cure times by up to 20 times ( time to Market )
• Reduced package stress – High Quality
• Localised reflow
• Re-work of IC’s / PCB’s possible
• Energy saving (“GREEN”)

More details about the Project can be found at the FAMOBS web site

If you feel that FAMOBS technology would be of benefit to your company please contact Paul C Jarvie

IC Package Innovation Network Motivation

The main motivation for introduction of this partnered forum was based on the following:

• IC Packaging is becoming a key enabler to the growing fabless community in particular
• Package technology such as (SiP) can offer high density, high performance and low cost-per-function for microelectronics systems integration.
• Allows the mixing of optimum active and passive device technologies in bare die format within a single package outline for cost effective, high performance, short time-to-market functionality well matched to a wide range of low, medium and high volume electronics product applications.
• The addition of embedded passive component technology within such SiP modules also promises further performance, size, weight and cost benefits.
• HETROGENOUS Integration is based on IC Packaging technology development.

Purpose

• Enable / facilitate collaboration, communication and Knowledge transfer
• Increase awareness externally of the network’s capabilities and opportunities
• Signposting of UK capabilities, requirements and strengths.
• Bring together the NMi and TWI networks providing opportunity for collaboration and innovative solutions.

Status

The Presentation materials , attendee list and Agenda from previous events are available to all NMI members in the member area  of this website.

The planning of the next IC Packaging Event is now in progress , and we still have opportunities for Speakers, Table Top Exhibitors and Sponsorship. If you are interested please contact Paul C Jarvie