Description

Optocap Ltd is an Assembly and Packaging Subcontractor for the Microelectronics and Optoelectronics industry. Optocap provides advanced packaging solutions to a world-wide client base of blue chip multinationals and leading edge start-ups. 

Optocap's Value Proposition offers our clients a number of advantages including; 

• Reduced Time to market
• Reduced Technical risk
• Reduced Product Development and Manufacturing costs
• Pure-Play Supplier - Optocap does not compete with its customers 

Optocap's services include: 

• Package design, modeling and verification
• Prototype and Pilot assembly
• New Product Introduction
• Automated volume manufacturing process development
• Process transfer
• Volume sub-contract manufacturing
• Supply chain management
• Environmental testing to Telcordia, JEDEC, IPC standards
• Device testing and characterisation
• Failure Analysis and Corrective action support 

Optocap utilizes its capabilities and know-how in a wide variety of opto and microelectronic assembly platforms including; 

Opto 

• High powered laser diodes
• Fiber coupled modules
• Sensors/Displays
• TOSA/ROSA's
• LED modules 

Micro 

• Fast-Turn IC assembly
• Flip chip assembly
• System-in-Package (SiP) assembly
• CMOS sensor assembly
• RF/MMIC module assembly
• MEMs

Optocap also offer a range of custom packaging and assembly options.