Description

The Scottish Microelectronics Centre is Scotland's World class centre in the Semi-conductor and MEMS Industry.  

From it's modern facilities within the Campus, of Edinburgh University at the King's Buildings. The SMC provides Research & Development, Analytical, Processing and Assembly activities for both Internal and external customers relating to the development of MEMS and Microelectronics. 

The SMC delivers specialist support to companies ranging from Start-ups through to Multi National corporations.

From its State of the Art facility, which includes both office and clean room space, an extensive tool set, first class support programmes, and networking opportunities and access to academic support from the 5 star rated Institute of Micro and Nano Technology of Edinburgh University.  

Through our support programmes we are able to smooth the progress of ideas and bring them to Market.   By using our service's and facilities on a "Pay as You Go" basis, companies can remove the barriers, of both high costs and long lead times that bar entry to Industry. 

SMC thrives on Partnership and collaboration. Talk to us today and see how your business can benefit from SMC's services.

Services

Analytical - In House Semi-conductor Analysis and Circuit Edit facilities provide a rapid turnaround service for Failure Analysis, Process Monitoring and IC repair.  The workhorse of the department is the Focussed Ion Beam Milling Machine, FEI 200, which has a copper etch compatibility and CAD overlay system enabling repair, cross-sectioning and circuit edit of Silicon semiconductor and MEMS devices. This is supported by SEM and AFM facilities. 

Processing Development - SMC provides a process development service for MEMS fabrication Semi-conductor integration. Processes can be flexibly developed and characterised on Wafer sizes from 75 to 200mm.  Facilities include I and G Line Stepper and contact Photolithography, Layer Deposition (LPCVD, PECVD), Metallization, and Dry Etch 9 including DRIE, CMP Wafer to Wafer bonding, MEMS Dry Etch Release and Surface treatment. 

Assembly - Customers are offered, low volume and rapid turnaround In-house packaging solutions.  Capabilities include Wire bonding, Wafer dicing.  We enable our customers to move quickly from design concept to functional prototype device. 

Incubation - The SMC provides specialist Business Incubation, which removes the barriers to Companies entering the Semi-conductor and MEMS Industry. SMC has an enviable track record in supporting successful start ups in the Industry.